Thermally conductive gel is a one-part, no post-curing silicone-based thermally conductive gel ideal for filling large gap tolerances. This thermally conductive gel has high thixotropy and plasticity, and can be uniformly filled into voids of different thicknesses under low pressure. It is suitable for scenarios where multiple heating devices share the same heat sink, or applications that require low mechanical stress. Protect sensitive electronic components from damage in electronic com-ponents.