Thermal Gel Pad is a made of thermally conductive gel, The special structural design ensures that the product generates extremely high  compression deformation under extremely low compressive stress,  and generates very weak or even negligible residual stress while  filling gaps of different sizes, which minimizes shock to precision  electronics, and is suitable for applications requiring multiple  deformation tolerances. The product has glass fiber to protect the  surface. It maintains good interfacial wetting characteristics,  maximally eliminates interfacial thermal resistance, and at the same  time has good operating performance, which is convenient for  installation.